|Thermal Testing Standards: JEDEC Standards - What's the Latest News?|
|Joint Mentor Graphics for this complimentary web seminar which aims to introduce existing thermal testing standards for packaged semiconductor devices.|
|Date:||April 20, 2011|
|Type of Event:||Conference, International|
Thermal Testing Standards: JEDEC Standards - What's the latest News?
April 20, 2011, Online
2pm US Eastern Time
Industrial solutions need standards. Standards on one hand make sure that an idea or a method can be implemented by anybody. On the other hand, industrial standards give confidence to end-users that the product or service that they pay for meet certain minimal requirements, therefore products from two different vendors conforming to the same industrial standard could work in the same system. The purpose of standards is just the same in thermal testing.
This webinar aims at introducing existing thermal testing standards for packaged semiconductor devices: an overview of thermal metrics, test methods and test environments will be given. The basic concept of the most recent JEDEC standard, the transient dual interface method for the measurement of junction-to-case thermal resistance will be provided – with the help of Mentor Graphics MicReD hardware and software tools. A few words on test based compact modeling will be given along with an introduction how these models can be used in Mentor Graphics' FloTHERM program. Recent news on emerging LED testing standards will also be given.
For more information and to register click here.
|Event record first posted on March 18, 2011, last modified on March 18, 2011|