CFD Online Logo CFD Online URL
www.cfd-online.com
[Sponsors]
Home > Events > Event Record #14720

CFD Events Calendar, Event Record #14720

Understanding the thermal impedances in power LED applications
Thermal impedance is dynamic property of any semiconductor package. In simple words, it describes how long does it takes for an encapsulated chip to heat up to the steady- state value of the junction temperature when the power is abruptly switched on or how long it takes for the chip to cool down to the ambient temperature when the power is switched on.
Date: July 27, 2011
Location: http://www.mentor.com/products/mechanical/events/led-applications-webinar
Organizer: Mentor Graphics
Softwares: FloTHERM, FloVENT, EFD (Engineering Fluid Dynamics), FloEFD
Type of Event: Online Event, International
 
Description:

Understanding the thermal impedances in power LED applications
July 27, 2011
10am London / 11am Europe / 2pm US-Eastern

Thermal impedance is dynamic property of any semiconductor package. In simple words, it describes how long does it takes for an encapsulated chip to heat up to the steady- state value of the junction temperature when the power is abruptly switched on or how long it takes for the chip to cool down to the ambient temperature when the power is switched on. Also, the steady-state value of the thermal impedance determines the temperature change of the junction due to the applied power step.

To register, click here
 
Event record first posted on July 14, 2011, last modified on July 21, 2011

[Back to Events Calendar Front Page]