Material for Xilinx FPGA

olsmir · February 12, 2018, 08:00

I have converted PCB into the FloTHERM project. This PCB has many components on it, including Xilinx FPGAs (like Kyntex-7, Artix-7). Would somebody explain me what material should I then assign to the Material attribute of such FPGAs? By default, this attribute has been assigned as "Lumped component".

Gabriel_C · February 14, 2018, 03:47

Hi,

lumped component is the least precise way of modeling <- only usable for finding PCB temperatures, air temperature inside enclosure...etc.

You should try to find the Rth's in documentation and create a 2R model at least. This will define the thermal resistance from junction to PCB and J to top of the device. Using this approach you can state how much of the heat goes through the top case and how much into the PCB.

Best case will be to have the detailed model (geometry and materials).

Best regards, Gabriel

jgstark · April 24, 2019, 01:36

PCBs are Stacked Laminates, it would be appropriate to model it as Orthotropic material.Refer this Calculator to find out kxy and kz (W/mK) of your PCB.

http://www.akemalhammar.fr/online/cond_pcb.html

For Modeling the Xilinx FPGA packages use 2R models (Rjc, Rjb) which is released by Xilinx on this link below.

www.xilinx.com/cgi-bin/thermal/thermal.pl

Congrats on your modeling..

February 12, 2018, 08:00	Material for Xilinx FPGA	#1
olsmir New Member Oleg Join Date: Nov 2016 Posts: 5 Rep Power: 9	I have converted PCB into the FloTHERM project. This PCB has many components on it, including Xilinx FPGAs (like Kyntex-7, Artix-7). Would somebody explain me what material should I then assign to the Material attribute of such FPGAs? By default, this attribute has been assigned as "Lumped component". Vinay Nandurdikar likes this.

April 24, 2019, 01:36	PCB Thermal modeling and Xilinx thermal models	#3
jgstark New Member 'Dhinesh_J_G Join Date: Apr 2019 Posts: 1 Rep Power: 0	PCBs are Stacked Laminates, it would be appropriate to model it as Orthotropic material.Refer this Calculator to find out kxy and kz (W/mK) of your PCB. http://www.akemalhammar.fr/online/cond_pcb.html For Modeling the Xilinx FPGA packages use 2R models (Rjc, Rjb) which is released by Xilinx on this link below. www.xilinx.com/cgi-bin/thermal/thermal.pl Congrats on your modeling..

Similar Threads
Thread	Thread Starter	Forum	Replies	Last Post
Setting the height of the stream in the free channel	kevinmccartin	CFX	12	October 13, 2022 21:43
mass flow in is not equal to mass flow out	saii	CFX	12	March 19, 2018 05:21
Ansys CFX problem: unexpected very high temperatures in premix laminar combustion	faizan_habib7	CFX	4	February 1, 2016 17:00
error message	cuteapathy	CFX	14	March 20, 2012 06:45
Two-Phase Buoyant Flow Issue	Miguel Baritto	CFX	4	August 31, 2006 12:02

February 14, 2018, 03:47		#2
Gabriel_C Member Gabriel Ciobanu Join Date: Jul 2011 Posts: 47 Rep Power: 14	Hi, lumped component is the least precise way of modeling <- only usable for finding PCB temperatures, air temperature inside enclosure...etc. You should try to find the Rth's in documentation and create a 2R model at least. This will define the thermal resistance from junction to PCB and J to top of the device. Using this approach you can state how much of the heat goes through the top case and how much into the PCB. Best case will be to have the detailed model (geometry and materials). Best regards, Gabriel