Natural Convection in Electronic Device (Handheld Comp.)
I need to do an analysis of natural heat convection in Electronic device which has processor that release heat. This device has many holes opening at the back of it. The problem is, I cannot setting boundary conditions (error: this face is not in between liquid and solid)
The setting that I did is as below:
1) internal flow
2) heat source: Volume source (Processor,capacitors) in Watt.
3) material for each components.
Anyone can help me, really appreciate for reply. :confused:
Actually, I don't uderstand that what's your problem, you can upload a photo about your model.
If have holes at the devices, they have no effect to caculate.
I think your problem is either you are trying to do an internal simulation on a model that is not a closed volume (every hole and gap needs to be closed) or you have an invalid contact somewhere.
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