I was interested in knowing if anybody used the ICEPAK for chip level and board level thermal simulations in electronic packaging applications. I need some feedback about the software. Thanks very much.
I have been using Icepak for simulating the electronic circuit boards. I have found it a very simple, user friendly and and efficient package for thermal simulation of electronic components.
It is very effective for component level, board level as well as system level simulation, provided the boundary conditions and the mesh quality are appropreate.
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