|February 4, 2009, 01:40||
Flotherm Thermal Load
Hi got an elementary question here which I hope someone can give me a quick reply with.
Is there any different between modeling a cuboid and placing a 10W conduction load on it via the thermal dialog and modeling the same cuboid and another component 'source' of 10W, which has the same size and position as the cuboid.
From what I see there is no significant difference.
If they are different, which is a better way to model a hard disk?
Feel free to point out any error the above methods possess as well.
Thanks for any reply!
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