LTCC(Low Temperature Co-fired Ceramic) substrate simulation
I have to analyse a LTCC substrate. I need to find the thickness of Dielectric material after Co-firing of LTCC with metal layers.
LTCC (Low Temperature Co-fired Ceramic) material is fired with Metal Layers (Silver) at a Temperature of 850 C and Pressure at Top and Bottom surfaces (350 Kg/cm2)
The Layer stack-up (Dielectric - 25 microns and Metal Layer - 15 microns)
The entire thickness of the Stack-up before firing is 145 microns and after firing is 100 microns.
I need to simulate with these Boundary conditions and predict the Dielectric thickness(deformation) after Firing (Pressure and Temperature Boundary conditions)
The side surfaces are fixed support.
Metal and Dielectric dimensions (4 x 4 mm)
50 % Metal presence
Kindly help me in this regard.
|All times are GMT -4. The time now is 15:20.|