I would like to simulate heat
I would like to simulate heat transfer from circuit board components to the air inside the case, then to the case, and finally to the air outside the case.
I think I would need to use buoyantFoam but I have no idea how to deal with the heat transfer from the air to the case or heat flow through the case.
Hi, look at: http://www.cf
You need basically for each phase (2 x air and solid) an own mesh. So things become a little complicated...
You can also use some kind of modified boundary condition. The choices you have are documented at:
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