Best Practices for Forced Convection Simulations, Part 1 January 24, 2013

(This event is available in multiple time zones and will be conducted in English)

• 10am (London) • 11am (Berlin/Paris) • 3:30pm (Bangalore) > Register
• 10am (Los Angeles) • 1pm (New York) > Register

The most common method for cooling electronics assemblies is best classified as forced convection cooling. The alternative classifications are natural convection (passive) cooling and radiative cooling (such as used in space-based applications). Forced convection cooling typically involves air being moved through a system by a fan, and the air removes the heat from the system via convection.

This web seminar is the first in a two-part series detailing the simulation of forced convection electronic systems using STAR-CCM+. Best practices for each step in the process will be discussed during the series; Part 1 will address:

• Air volume definition
• Appropriate boundary conditions
• Mesh requirements
• Treatment of fans

This seminar is targeted to either looking at or already performing thermal simulations of electronics assemblies.

This webinar is free, but registration is required to obtain log-in credentials:
10am (London) • 11am (Berlin/Paris) • 3:30pm (Bangalore) > Register
10am (Los Angeles) • 1pm (New York) > Register