Geometry Preparation for Electronics Thermal Simulations:Tips, Tricks, & Best Practices

June 06, 2013 (This event is available in multiple time zones and will be conducted in English)

• 10am (London) • 11am (Berlin/Paris) • 2:30pm (Bangalore) > Register
• 10am (Los Angeles) • 1pm (New York) > Register

Historically, thermal simulations of electronic systems have utilized dramatically simplified geometric versions of the systems. The simplifications show up in two main ways:

1. Part count reductions, where assemblies that might actually contain thousands of components are simulated using 200 parts or less.
2. Individual components are dramatically simplified so that they end up as nearly or completely orthogonal even when in reality they involve highly sculpted, organic shapes.

For some assemblies the inaccuracy due to these simplifications is still in acceptable levels, but for many modern designs the simplifications would cause unacceptable deviations from reality.

This seminar details techniques for modeling even the most complex geometries in STAR-CCM+. CD-adapco has decades of experience modeling highly detailed, complex assemblies, and various tools and techniques in STAR-CCM+ allow the thermal analyst to include all the detail needed for an accurate simulation.

This webinar is free, but registration is required to obtain log-in credentials.
10am (London) • 11am (Berlin/Paris) • 2:30pm (Bangalore) > Register
10am (Los Angeles) • 1pm (New York) > Register