[Rmin]

CFD Project By (Sucessive Over Relaxation by line Method)
According to the figure below, an electronic chip with dimensions (20mm*8mm) with the coefficient of guidance 𝐾c = 50 𝑊/𝑚𝑘 is placed in its base, which is a box. The box is filled with a material that has a conductivity coefficient of 𝐾s =5 𝑊/𝑚𝑘 . The box is insulated on its 3 sides, and on its upper side, it exchanges heat with air flow at a temperature of 𝑇∞=20𝐶 and a conductivity coefficient of ℎ∞= 500 𝑊/(𝑚^2 )𝑘. The amount of heat that the chip produces and transfers to its substrate is equal to 𝑞∙=10^ 7 (𝑊/𝑚^3). This box is connected from below at point C described in the table to its base, which is at a temperature of T=15c. By using numerical solution,obtain the temperature distribution inside this set obtained in steady state conditions.
In your report, show the temperature of the points appropriately, and draw the constant temperature lines. In addition, show the temperature distribution inside the field in colorful.
Show that your results are correct by analyzing the results, examining the temperature of the points, and calculating the thermal balance on the boundaries.
Get results using only SOR by Line method. Continue this method by repeating the process below until you get the final result. A back and forth sweep in the x direction and then a back and forth sweep in the y direction.
Relaxation=Applied after each sweep

From point C to point 365 connected to a temperature of 15 degrees (including both points)
the picture is attached.
i will be appreciate you if you could help me .

[aeroshiva7]

i can help you in this
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