[SOHYEON MUN]

Hi. guys.

I am employed in relating to RRH(Radio Remote Head) and design mechanism and thermal structure from component to closure structure by using Flotherm.

I was just wondering how to design component level such as FPGA, Flash memory for other company. There is no difference between 2R model and detailed model as i know.

Of course, If you use detailed modeling, the result is more accurate. however It takes a long time for data to calculate due to number of grids.

How do you design component or PCB at system level ?

[Gabriel_C]

Hello,

there are definitely differences in results between detailed modeling and the simple 2R components (differences that obviously are more visible with more power applied).
When performing PCB simulations (70% of my work time) I have one basic rule that I follow: the level of details in the model must be of the same magnitude in the entire system.
For example: A detailed component (I make components with flopack and then run several simulations on JEDEC environments to match Rth’s form the datasheet to the model) should be associated with a detailed PCB (each layers modeled individually with copper patches, thermal vias…etc) and a detailed enclosure (shape and volume). On the other hand, a big system with coolers, heatsinks, displays, several PCBs can be modeled with 2R compact components, averaged PCB orthotropic thermal conductivity…etc.

Best regards, Gabriel