Thermal resistance junction to board (Rth_jb)
 

Hi all,

Software used : ANSYS ICEPAK

Topic about : extraction of thermal metrics of an IC (integrated circuit) package. BGA an example.

For Theta-JB or Rth_jb : It is understood that , a ring style cold plate setup is to be created as Boundary condition. How to replicate this cold plate setup in ANSYS ICEPAK ?

Can anyone throw some insight on extracting Rth-JB using ANSYS ICEPAK ?
It is possible to get Rth-JB directly using the package from Library search. But I wanted to do this extraction for a manually created package in ANSYS ICEPAK

It's very simple in Icepak, start by using the macro-->packages-->BGA-->characterize JB