[steph79]

Hi,

I'm trying to model the flow of molten solder in a PCB hole which is partially occupied by a component and the solidification of the solder thereafter. For this I'm using VoF (2 phases), solidification/melting with surface tension and wall adhesion.

I'm experiencing massive diffusion of the melt front (which I perceive to be a numerical artefact) and was wondering if anyone had any advice on how to alleviate this issue. I'm using mostly high order upwind schemes and I've tried refining the mesh and reducing the time-step with no appreciable improvement in the melt front behaviour.

Has anyone tried anything similar for casting simulations etc?

Thanks.