# thermal resistance in cht problems

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 October 11, 2013, 01:43 thermal resistance in cht problems #1 New Member   Join Date: Sep 2013 Posts: 3 Rep Power: 6 Hi everybody, I am at my first experience with openfoam and I am interested in simulating a steady-state cht problem. So far I was able to run a simple case by using the chtMultiRegionSimpleFoam solver. In order to create the interface between the different regions, I have used the turbulentTemperatureCoupledBaffleMixed. This boundary works fine but I did not find any method to set the thermal resistance between two solid parts. Please, can you suggest me a strategy in order to solve this problem? Thanks in advance for your help.

 October 11, 2013, 09:48 #2 Senior Member     ahmed Join Date: Feb 2010 Posts: 175 Blog Entries: 1 Rep Power: 9 welcome bangelo, please could you explain what do you mean by thermal resistance between solid regions. thermal conductivity is already defined for every solid region.

 October 11, 2013, 12:03 #3 Senior Member     Marco A. Turcios Join Date: Mar 2009 Location: Vancouver, BC, Canada Posts: 716 Rep Power: 21 He means the inverse of the thermal contact conductance: http://en.wikipedia.org/wiki/Thermal_contact_conductance This should be handled with a boundary conditions, but I don't know if Foam has such conditions (haven't dug deep enough myself). Ahmed Khattab likes this.

 October 12, 2013, 03:12 #4 Senior Member     ahmed Join Date: Feb 2010 Posts: 175 Blog Entries: 1 Rep Power: 9 hi marco, i think he don't need to input such resistance as he will entering thermal conbuctivity. then openfoam will deal with it or convert it to resistance. am l right?

October 14, 2013, 08:01
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Quote:
 Originally Posted by mturcios777 He means the inverse of the thermal contact conductance: http://en.wikipedia.org/wiki/Thermal_contact_conductance
Hi Marco, this is exactly what I mean.

Quote:
 Originally Posted by rebel ahmed i think he don't need to input such resistance as he will entering thermal conbuctivity. then openfoam will deal with it or convert it to resistance.
Hi Ahmed, what you say would be right if you really simulate the contact region between the two parts. Anyway, as the contact region is very thin (we are speaking about some microns), its mesh would be very demanding and for this reason one prefers to work with its thermal resistance (thickness/k).

The link Marco posted shows very well what I mean.

 October 14, 2013, 11:57 #6 Senior Member     ahmed Join Date: Feb 2010 Posts: 175 Blog Entries: 1 Rep Power: 9 Dear Pangelo, this information is really new for me, thanks for your information. i think there is a case in openFoam.2.2.0 for cooling of electronic circuit, maybe you will find your target there. thanks and good luck

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