Bonded Contacts in Thermal Stress.
 

Hi all,
Recently i was doing a thermal stress simulation in ANSYS WORKBENCH for electric motor. We used bonded contacts between two bodies which in real world uses an interference fit while assembly. The results of the simulation showed a very high value of the stress and will lead to failure. My question is that, can we take bonded contacts for such a fit and is it okay to use bonded contacts in thermal-stress simulations?

Thanks.