United States, May 8, 2014
This seminar will present the most up-to-date 3D analysis and efficient heat transfer methods available for mechanical and electronic system design, including components and assemblies.
CFD specialists will present examples of thermo-fluid dynamic (CFD) 3D calculations to effectively evaluate the temperature of components, including capabilities for heat exchangers, air conditioners, and cooling of electronics.
As an attendee, you will receive firsthand knowledge of how companies apply design-time settings for the simulation of heat transfer in forced convection, conduction, and thermal and solar radiation scenarios. A discussion on the calculation and interpretation of heat transfer coefficients will follow.
This workshop is free, but registration is required. Sign up today at http://www2.cd-adapco.com/l/14592/2014-03-19/6914c.