Recently Cradle announced the release of Cradle PICLS for Printed Circuit Board (PCB) thermal analyses. PICLS is an easy to use, real-time, PCB thermal analysis tool that facilitates complex PCB heat transfer analyses. It uses an intuitive two-dimensional user interface to model multi-layers PCBs including foil thickness and vias.

One of the revolutionary benefits of PICLS is its real-time analysis capabilities. Using PICLS, designers can rearrange components on a PCB and immediately assess thermal transfer and changes in the temperature distribution. Imagine the impact on design cycle time and the design review process.

PICLS results can be output as a report or seamlessly imported into Cradle scSTREAM or HeatDesigner CFD software to efficiently advance into system analyses.