Cradle now offers a 20 minute, no-charge, informational webinar about PICLS, an easy to use, real-time, Printed Circuit Board (PCB) thermal analysis tool that uses a 2-D graphical interface for intuitive operation.
Using PICLS, engineers can rearrange components on a PCB and immediately assess thermal transfer and changes in the temperature distribution. In addition, PICLS can
- Model multi-layer PCBs, foil thickness, and vias
- Generate and import semiconductor components from Cradle ElectronicsPartsMaker, and
- Output results as a report or seamlessly export them to Cradle scSTREAM or HeatDesigner for system design.
Click
here for PICLS webinar registration information.