Cradle PICLS (PCB Instant Thermal Simulation) is a real-time Printed Circuit Board (PCB) thermal analysis tool developed specifically for electrical designers during PCB conceptual/preliminary design. PICLS eliminates unnecessary PCB redesign work by creating a fast, easy to use PCB thermal analysis tool that electrical designers can use to assess the impact of electronic component reallocation on PCB temperatures.

PICLS success can be largely attributed to its intuitive 2D interface, which is a familiar medium for electrical designers. Pre-processing, solving, and post-processing are combined into one interface. Designers can rearrange components and features on a PCB and immediately assess thermal transfer and changes in the temperature distribution. This capability increases the likelihood that the PCB design will be thermally robust when mechanical designers perform the system thermal analysis downstream in the process.

Cradle offers a short, 20 minute, no-charge online webinar that introduces PICLS operation and capabilities. Click here for more information.