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This seminar will present the most up-to-date 3D analysis and efficient heat transfer methods available for mechanical and electronic system design, including components and assemblies.

Thermal simulation specialists will present best practices for accurate and efficient heat transfer simulations applied to electronics. Both natural and forced convection will be addressed. Advanced physics including radiation and phase change will also be presented. Finally, the trends for detailed 3D geometry and wider range of physics observed in electronics applications will be discussed.

This is an educational event you don't want to miss. Sign up today!