FLOMERICS FURTHER ENHANCES PRODUCTIVITY OF THERMAL DESIGN ENGINEERS WITH FLOPACK VERSION 6.2

(February 16, 2007) -- Flomerics has further enhanced the productivity of Thermal Design Engineers with the launch of Flopack V6.2 (www.flopack.com) - the latest version of its web-based SmartPart library that generates fast, accurate thermal models for IC packages and associated parts. Thermal models created within Flopack can be instantly imported into Flomerics’ Flotherm or FloPCB software to analyze the cooling requirements of electronic components, boards and systems. Key new features contained within Flopack V6.2 include: a major expansion of the power/discrete semiconductor package library; a new parametric rules engine that checks for errors in design data inputs; an enhanced, more accurate model for bond-wires; and overall improved usability.

Commenting on Flopack V6.2, Sarang Shidore, Flomerics’ Product Manager for Semiconductor Software Products said, “Providing Design Engineers with productivity gains is the driving force behind all of Flomerics’ products. Flopack V6.2 achieves this by continuing to expand its already formidable package portfolio, incorporating new design-friendly features, and by making it even easier for those people who are not usually involved with IC package design to realize substantial improvements in productivity."

For more details, please visit www.flopack.com

Further information can be obtained from: Dr. Mike Reynell, Director of Marketing, Flomerics Limited, 81 Bridge Road, Hampton Court, Surrey, KT8 9HH, UK. Tel: +44 (0)20 8487 3000.

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