|
[Sponsors] |
July 30, 2015, 06:36 |
Electronic free cooling in a hermetic box
|
#1 |
New Member
Join Date: Jul 2015
Posts: 1
Rep Power: 0 |
Hello, I am working on an electronic free cooling problem (with air). For the first experience, my model is composed of a microprocessor on a PCB in a completely hermetic box (with 2 air spaces) with an exterior air (modeling by a 0.2m ray sphere).
Conditions: -Boussinesq approximation with an air at 318.15K (exterior and interior) in Z direction -Power dissipation of processor: 1W. Visualization: I have some problem on my model for determine the connections between solid and fluid. For example when I determine a connection between the exterior air and the box (corpse to corpse), when I open fluent, the box is set automatically in fluid (but it was set in solid before). I try to do some connections between solid and fluid with only corpse and face connection but I have no thermal dissipation in the fluid when I solve it. Example of connection: So my question is : how can I do properly the different connections to have a dissipation in the air (interior & exterior) ? Sorry for my bad English, I hope it was understanding. |
|
Thread Tools | Search this Thread |
Display Modes | |
|
|
Similar Threads | ||||
Thread | Thread Starter | Forum | Replies | Last Post |
free RANS code with free surface ability | Lou jing | Main CFD Forum | 1 | July 11, 2003 15:43 |
CFX 4.4 New free surface option | Viatcheslav Anissimov | CFX | 0 | April 3, 2002 07:27 |
gravitational force for free surface flow | Jongtae Kim | Main CFD Forum | 1 | July 2, 2000 12:57 |
free convection heat transfer from a heated horizontal surface through a liquid to a thin cooled fin | Kaushik | FLUENT | 1 | May 8, 2000 07:47 |
Variable Density - Free Surface with FIDAP | Vitaliy Pavlyk | FLUENT | 7 | May 2, 2000 16:56 |