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Old   February 5, 2021, 07:54
Question thermal expansion mismatch stress
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I have a question on simulating thermal spraying. I want to simulate the flow, solidification, and cooling process of a liquid particle impacted onto a solid surface. In the actual thermal spraying, thermal stress is generated due to thermal constriction of the particle which is bonded to the substrate after solidification. So, could you tell me is that possible and how to simulate the flow and thermal stress generation in a single simulation? Thanks.
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thermal praying, thermal stress

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